Thermal coupling in ICs: aplications to the test and characterization of analogue and RF circuits

In this presentation we cover how to use low frequency or DC temperature measurements to observe figures of merit of high frequency analogue circuits.Postprint (published version

Frequency characterization of a 2.4 GHz CMOS LNA by Thermal Measurements

© 2006 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.This paper presents a technique to obtain electrical characteristics of analog and RF circuits, based on measuring temperature at the silicon surface close to the circuit under test. Experimental results validate the feasibility of the technique. Simulated results show how this technique can be used to measure the bandwidth and central frequency of a 2.4 GHz low noise amplifier (LNA) designed in a 0.35 microns standard CMOS technology.Peer ReviewedPostprint (published version

Using temperature as observable of the frequency response of RF CMOS amplifiers

The power dissipated by the devices of an integrated circuit can be considered a signature of the circuit's performance. Without disturbing the circuit operation, this power consumption can be monitored by temperature measurements on the silicon surface. In this paper, the frequency response of a RF LNA is observed by measuring spectral components of the sensed temperature. Results prove that temperature can be used to debug and observe figures of merit of analog blocks in a RFIC. Experimental measurements have been done in a 0.25 mum CMOS process. Laser probing techniques have been used as temperature sensors; specifically, a thermoreflectometer and a Michaelson interferometer.Peer ReviewedPostprint (author's final draft

Thermal coupling in ICs: aplications to the test and characterization of analogue and RF circuits

In this presentation we cover how to use low frequency or DC temperature measurements to observe figures of merit of high frequency analogue circuits

Thermal coupling in ICs: aplications to the test and characterization of analogue and RF circuits

In this presentation we cover how to use low frequency or DC temperature measurements to observe figures of merit of high frequency analogue circuits

Non-invasive RF built-in testing using on-chip temperature sensors

This poster shows how to efficiently observe high-frequency figures of merit in RF circuits by measuring DC temperature with CMOS-compatible built-in sensors.Peer Reviewe

Non-invasive RF built-in testing using on-chip temperature sensors

This poster shows how to efficiently observe high-frequency figures of merit in RF circuits by measuring DC temperature with CMOS-compatible built-in sensors.Peer ReviewedPostprint (published version

Non-invasive RF built-in testing using on-chip temperature sensors

This poster shows how to efficiently observe high-frequency figures of merit in RF circuits by measuring DC temperature with CMOS-compatible built-in sensors.Peer Reviewe

Review of temperature sensors as monitors for RFMMW built-in testing and self-calibration schemes

This paper presents an overview of the work done so far related to the use of temperature sensors as performance monitors for RF and MMW circuits with the goal to implement built-in testing or self-calibration techniques. The strategy is to embed small temperature sensors on the same silicon die as the circuit under test, taking advantage of empty spaces in the layout. This paper reviews the physical principles, and presents examples that reveal how temperature sensors can be used as functional built-in testers serving to reduce testing costs and enhance yield as part of self-healing strategies.Peer ReviewedPostprint (published version

Review of temperature sensors as monitors for RFMMW built-in testing and self-calibration schemes

This paper presents an overview of the work done so far related to the use of temperature sensors as performance monitors for RF and MMW circuits with the goal to implement built-in testing or self-calibration techniques. The strategy is to embed small temperature sensors on the same silicon die as the circuit under test, taking advantage of empty spaces in the layout. This paper reviews the physical principles, and presents examples that reveal how temperature sensors can be used as functional built-in testers serving to reduce testing costs and enhance yield as part of self-healing strategies.Peer Reviewe